Vapour phase is close to the "ideal" reflow soldering method, as the temperature is consistent and defined by the boiling point of the fluid. You don't need to worry about overheating or board profiling.
One reason it's not common in industry it's hard to integrate into a continuous production line - it's usually used as a batch process, particularly for heat-sensitive components.
However the problem is that the fluid is expensive, and hard to buy in small quantities.
For double-sided, most parts will stay on due to surface tension of the solder. Larger parts may need glue dots