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Well, Zeptobar´s pictures are better...There is a very thin gate grid surrounding the drain and source areas contacted by the metal layer.There are three round areas without contacts and gate grid. Would be interesting what these round areas do. Do they lower the current density? Do they optimize the manufacturing? Some weird noise reduction?
Quote from: Noopy on August 21, 2021, 03:32:33 amWell, Zeptobar´s pictures are better...There is a very thin gate grid surrounding the drain and source areas contacted by the metal layer.There are three round areas without contacts and gate grid. Would be interesting what these round areas do. Do they lower the current density? Do they optimize the manufacturing? Some weird noise reduction? Do I understand it right. Those tiny electrodes connected to bond pads are D/S and the die itself is Gate?
The 2AW was one of the cheapest BF862 I found on Ebay (0,5€ while the 2Ap was 2,74€).The surface of the package looks a little strange like it was sanded.
Do I understand it right. Those tiny electrodes connected to bond pads are D/S and the die itself is Gate?
I wonder if those "holes" in BF862 could be connections between the top grid and the substrate.
It absolutely makes sense.
Thanks! Would be a good solution for a RMS detector. The more modern version is the LT1088:https://richis-lab.de/LT1088.htm
The wires were soldered to the connector pins... ...but that tin ball doesn´t look good.
It reminds of the rod and crankshaft from the Steam logo: