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DIP SMT package
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Topic: DIP SMT package (Read 835 times)
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Alex Eisenhut
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DIP SMT package
«
on:
May 23, 2019, 11:38:33 pm »
Using the LOC112S
https://www.digikey.ca/product-detail/en/ixys-integrated-circuits-division/LOC112S/LOC112S-ND/654965
It is basically a DIP8 with the leads splayed out and clipped.
Here's my question, given the large size and weight of the chip, will the tiny SMT pads recommended have enough surface tension force to pull the package straight at reflow?
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T3sl4co1l
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Re: DIP SMT package
«
Reply #1 on:
May 24, 2019, 07:43:33 am »
Parts about 1206 and larger, the package weight tends to dominate over surface tension.
Basically, place it right the first time.
Tim
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DIP SMT package
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