Regarding the Foot Print Designing for Microcntroller based on Wire Bonding Tech

[Anirudh_THABJUL]

Hiee everyone,

I am a Hardware Engineer and also a PCB designer.

I am using a Microntroller which is in CHIP PACKAGE.

So in order to connect our microcontroller with my PCB, i am using WIRE BONDING TECHNOLOGY.

So, Can any one suggust

Q1. which type of wire bonding is the best among this **Ball Bonding, Wedge Bonding, Compliant Bonding**  technique's?

> SPECIFICATIONS:

> I. Size of Microntroller - 3.6mm X 3.6mm

> II. Thickness Of Microcontroller - 200um

> III. Low Power Application[/b]


Q2. How to design foot print for PCB designing according to choosen wire bonding technology ?


Can any suggust a better Websites or Pdf Link's etc.. about wire bonding technology?.


Regards,

Anirudh THABJUL

**Lansa Diffusion**, Paris, France