Better like this:
The inductor can be adjacent so the SW node has basically zero size, and the bootstrap cap is a small trace sneaking around just below.
The ground doesn't even need to flow under the chip, fine to use a couple more vias to do the same thing and then SW can go under the chip to BS without any vias on SW.
Note they recommend inner layer, i.e. this is a 4+ layer layout. So you can have inner/bottom copper covering (surrounding) the switch node with ground pour, so it doesn't expose any emissions. I don't mind having fair sized pours like that, as long as nothing else needs inner-1 in the area of course. Which, you'll usually be putting this in a PSU section by itself, so that's fine, but be careful on high density builds.
Tim