Great observation! I would expect that a .hex works for the the same family of µCs (like stm32f103<xxx>, stm32f407<xxx>), but depends of course on the peripherals feature set. Should try some more variants like F030->F051; that's where I think problems could arise (at least if you use a binary for the bigger µC on the smaller one). For the ARM based µCs, ST has an AppNote (AN3364) which explains the compatibility a bit:
http://www.st.com/web/en/resource/technical/document/application_note/DM00024853.pdfGood news here as well, TI shipped some ICs on monday which are already close to my place now and should arrive today
Monday: 11:45 am Picked up GRAND FORKS, ND
Tuesday: 5:24 am Departed FedEx location MEMPHIS, TN
8:08 pm Arrived at FedEx location ROISSY CHARLES DE GAULLE CEDEX FR
9:33 pm International shipment release - Import COLOGNE DE
Wednesday: 4:05 am Arrived at FedEx location HANNOVER DE
... which is ~100km from here and thus should get delivered soon.
These parts are in the envelope:
TPS60302 - Single-Cell to 3.0V/3.3V, 20mA Dual Output, High Efficiency Charge Pump
TPS60200 - Regulated 3.3-V Low Ripple Charge Pump With Low Battery Indicator
TPS61097A-33 - 0.9Vin, 3.3Vout Boost Converter with Bypass Switch - 5nA Shutdown Current
TLV61225 - Single Cell High Efficient Step-Up Converter in 6 pin SC-70 Package
I think they are a good choice to also compare different technologies for buck and/or boost.