What is wrong with hot air, a hot plate, or even a small reflow oven?
Thanks, For a proto board, its going to be easier to just solder it like explained in the top post?
Hot plate...cant do as components both sides.
Hot air...will blow off other components.
We may want to desolder it and put a different 5x6mm fet on...so if we can just do it with solder irons then it will be quicker.
Also, a small reflow oven instead of doing it the way of post 1.....it would be extra expense.
Squirting out all the solder paste out of the stencil makes solder ovens a long job.
This is treating the soldering like as a DPAK..and you wouldnt bother with hot air/oven etc with a DPAK.
And why are the outside pins bigger than the inside.
So its easier to solder the gate without shorting to the adjacent source.
Who needs thermal via's.
Thanks, we can still add thermal vias.