Hi,
As my eyes wander over the board (i.e. in no particular order of importance)
Placement and tracking:Good routing stems from good placement. Get the placement right and the routing usually falls into place.
Generally, If your placement is bad then the routing is bad. If the routing is bad then you can cause problems.
Look at the area of R17-22, consider rotating and moving them all so that your not going around the end to get to the pad, a simple 90 degree rotation on R20-22 for instance.
However, you can move them closer to where they need to go by being more creative with rotations, don't just think "oh they are in a pretty line - that must be best" as it's not, it may have been for manual PTH assembly but a machine does not care so place them for best routing.
Rotate C6 and place it closer (this applies to a lot).
The tracking from pins 2-3 (if 4 is gnd) on IC4 - whats the point in the vias? I dare say you did have a route there before. redo this.
The track from the +v of C10 that goes to C4 passes directly under the oscillating tracks of the crystal, it would be better to route this around the top (given that your gonna bring the crystal closer yes?). If the crystal comes down a little then you can remove several of those vias by re routing the tracks.
Look at R4, if using a placement machine this is a skewed component waiting to happen, as the hot solder starts to cool, the tracks will cool it faster and as they are in opposite directions will pull the component closer thereby skewing it. rotate the component. In fact rotate a lot of them, the track over the top of R3 should just not happen, this is in many places.
Pull the ICSP connector closer to the IC and you can remove several of the tracks that need to go to the other side.
IC 6 pin 2 track exits right, gos underneath (stop here) rip it up and route it out from the top then left, your bottom track will be shorter.
IC2 output to C11 +v is thinner than the rest of the net, whats the point in that? thicken it to match.
Move C10 closer to IC3's pin.
What's with all the stitching vias below IC2? did you move it?
Tracking around mounting holes - either side: depending on how it's being mounted, consider the size of screw heads and mounting standoffs, if they are metal then keep clear of them.
Legend: This needs more work - be consistent with the font size, ensure it is 4 thou from all pads (a good fab house will removie it from pads, a bad one will not).
Label terminal blocks clearly.
Do not have legend component identifiers (names) under the components - always beside them.
If there is no room place them nearby with a legend line pointing to the component. (I cannot see the need here)
Diodes, place a marker outside the component to identify polarity, the component themselves generally just have a bar.
Add a - sign next to the electrolytics, this is after all how they are physically marked. (so with +&-)
Redo the placement at L1/D1 so they are closer to the pins, there are lots of switching currents going through those.
The UART header, this can fit where the BLDC legend text is and make the trace shorter and not pass under the crystal.
Add pin 1 markers next to the IC's
Do not have legend going over a via, move it if you can, if you cannot - consider moving the via. (ink falls into the hole making it unreadable.)
Groundplane: This should be consistent, cover as much area as possible, it should not be broken up with traces. If you can minimise the cutouts in it it would be better.
Look at each bit of ground, consider the return paths of the current for each track. They should return directly - not through a meandering path.
Sometimes it's better to make a track go the long way around rather than cut through a ground, especially if it cuts off the supply to an area that needs a good ground.
Stitch it well (vias) especially when you have a top piece jutting out and its over a bottom piece.
Pull it back further from the mounting holes.
The little bits going between Q1 etc. can be more trouble than they are worth, can you set it so it does not do thin bits before pouring?
Schematic: Pull the ICSP connector up a bit, move the HALL one down to give you room to move R4-R6 above so they appear to pull up (which is what they are doing) rather than appearing to pull down (which is what a quick glimpse appears to show).
Pull ups go up, pull downs go down
Move the text so it is not over connections etc - it must be clear to see and read.
The GND symbol going to the IC3 GND pin, move this to the RH end of the bottom of C6.
Then join the ground from the current junction point on IC3 pin 2, to the bottom of the C5 gnd.
Then pull the left bit all down and you have more room to line them up neatly, get text in etc. (you have space, use it).
The UART connector outline goes over a track, not good - perhaps rotate and move the connector up causing a right angle in its connections but will look better.
Be consistent with the reading directions and placement of all text.
Draw a box around the whole thing (a border) this will allow printer margins to work better so your not going to have items really close to the edge and possibly not printed well (it will scale to fit).
Have a beer.