Are we talking the pcb layout or the entire design ?
Entire design : as many as needed. Build a number of prototypes. Possibly sections of the circuit. Simple rectangular board to get bench testing going and develop firmware. inject lots of testpoints and dummy parts or cuttable pathways.
As the design nears completion start working on form and fit. Work within mechanical constraints: size, shape.
After thermal , emi , vibration and other aspects have been tested respin the board. During this cycle component selection may change. Different connectors, transformers, capacitors. Different locations. Final enclosure shape may change.
So the board needs to adapt.
In telecoms i respun board because of components impeding proper airflow for cooling in the 24 inch telco racks. Or respin them because they had issues during assembly ( all heavy components on one side giving problems in the pick and place machine.
In automotive I made modules that hade many late changes. The factory floor people complained it was difficult to plug in the wiring harness because of an odd bend they had to do on the conveyer. it was difficult to reach-in to plug in three connectors. Scrap the entire design, go to a different connector, position it differently. Later on we ditched it again because there was an additional cooling duct required above it for the power hungry computer module above it. ( between glove box and footwell ). Things change during design, especially when the board is part of a larger system. All these aspects were looked at. How difficult is it to assemble, how does the module fit, thermal, vibration, assembly time, installation time. Mosfets did not behave as intended. Global part shortages. Footprints were made so they could hold many different parts allowing for late-game changes. Optimize for mass production so it was faster to assembly with higher yield. It's a continuous process.
Space was yet another can of worms. A launcher undergoes extreme vibration during take-off .J-bend stacked ceramic capacitors literally flew off the board. Ferrite core transformers would crack their core and bits and piece would go flying.
Connectors had issues with foreign material ingress. Do we put the male or female on the board ? How many times will a connector be removed during assembly or launch operations. Where is the risk for damage. A bent pin on the wiring harness is a disaster as you can't easily swap the harness. But you can easily swap a module. A socket can get plugged by debris. Sometimes connectors need ability to be inspected visually. We're talking 38999 family onnectors that cost 500$ a piece... Someone has to reach into the interstage to plug in the GPS simulator while standing on a boom lift. Come launch day : remove simulator and plug in the stage computer.
So these boards underwent extensive testing on vibration tables. The enclosures woudl flex and warp and needed reinforcement ribs. This would impede part placement and mounting hole placement. Boards would vibrate in spots and crack vias so additional mounting holes were required, or needed shifting of the holes to stop resonance points. Then all of a sudden the module was to be rotated or flipped in the nosecone or around the fuel tank and now the entire dynamics changed ... -> respin board. We need more sensors inputs -> respin. we need more actuators. we also want to monitor xyz -> respin respin respin.
Same for aircraft. Rotate, consolidate, add stuff. The power controller got mechanically so complex that it became unreliable due to all the interconnects. Migrate to rigid flex. The board folds post-assembly and 90% of the interconnects are gone as they are now part of a single piece board instead of 4 boards plus associated wiring harnesses. Only two 38999 connectors and a power busbar remain. Electrically the system has not changed. But the pcb layout has shifted technology , form , assembly and installation to make the entire assembly more reliable and easier to manufacture. No more harness mistakes or bad connections between boards. It is one board and can be fully tested pin to pin before going into the mechanical assembly.
it is unreasonable for a design to be frist time right, let alone the board to be first time right.
The only place where i have known first time right is in silicon design, but that is a totally different world. There you have the tools and the timeline to do this. Simply becasue building the first run is so massively expensive. You can't prototype. PCB is cheap ( a few k$) and fast (3 to 4 days if needed) . Silicon not so much ( millions of $ for a maskset) and 6 to 8 week turnover in the factory.
In silicon world you take your time and simulate the snot out of the design. You have the tools and data to do it ( which also cost a fortune)
For PCB level this is not required. The respin is fast and cheap. The PCb level simulation tools are nowhere near the capabilities in the silicon world. They don't need to be different problem to tackle, different cost, different domain.