Just for the records, the transaction from m68k to PowerPC took six years, and chips were manufactured by the same company. At some point, the contracts with Motorola were then moved to the new division Freescale. This for sure added some delay, anyway, it took six years.
One of the good-good reasons for using the PowerPC architecture is in real-time operation. There is a whole market for safety-critical equipment where even a small unpredictable delay is a problem. When a delay can kill people, or destroy millions of dollars of equipment.
There are some new ARM designs that are now reaching acceptable levels of real-time operation. ARM did some progress in 2016. But ARM does not manufacture itself, so it takes a couple of years for real processors to be available after the design. Last 2018 chips are interesting, a lot interesting even if they are still significantly lower performance in processing power compared to a PowerPC.
I do believe the architecture of RISC-V can (and will) be tuned to do it better, but one thing that PPC still does better than any other chip is radiation-hardened designs thanks to the contribution by IBM.
This is not "ISA architecture", this is "how the chip is made", and this is mainly due to the fact that the chip-manufacturer has by far the best fabs for rad-hardening but they have also redesigned parts of the chip to increase reliability.
Do you know that potentially AMD has the know-how (and potentially even the fab) for the satellite market but has always refused to do it? The reason is unknown, but it's interesting, since they could have potentially switched from x86 compatible to PowerPC. But they have never done it.
Switching from PowerPC to RISC-V is not a matter of redesigning the "die film", but rather a matter of literally redesigning everything. You have to simulate everything and to run a lot of experiments on it to pass qualifications. This can be done, but it's like talking about enormous amounts of money and resources and exploring numerous dead-ends, which would eventually concretize something for the avionics market.
Hence, if I was a CEO, I would reach it progressively. From level C to level B, from level B to level A.
The SEU Radiation Events program is very interesting. The entry-level is for alpha-particles-tolerant systems, which can be shielded thus only concerned with internal alpha sources, and this can be mitigated by enforcing the hardware qualification process, by choosing Level A and level A+ manufacturing, and requiring that there are no impurities and/or contamination of fab. process. But Neutrons-tolerant systems have a problem with cosmic ray flux, which depends on location, altitude, and atmospheric conditions, and it's very difficult to shield; in this case, you need chips qualified for SEU. The hardenest scenario is SEU/Neutrons, which are designed, tested and qualified as "radiation-hardened".
Even the CPU's internal cache needs to be protected via parity/ECC, and the external memory cells are spread to avoid a multiple-bit upset. IBM's, Motorola's, Freescale's, and AMCC's devices were/are built with ruggedized technology and designed with rules to mitigate those threats.
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In short, in my opinion, "real-time operations made in ruggedized technology" is the keyword you have to beat.