More important is if there is air flow over that area. The biggest heatsink in an enclosed box has very little heat transfer. Make a hole and mount it with a nut and bolt to the board, and use a thermal pad between the device and the board as well, this will make a bigger difference than solder masking. The board does not need the solder mask removed where the device mounts either, as it is an insulated device in any case, and the mask is going to be as good as the board in heat transfer. If you have the space a U shaped heatsink would be a better idea, it does not have to be that big for low power if the bare device alone is capable, it just makes it run cooler and more reliably.