At first, I plan to use regular SMT-components on a PCB, maybe with a shielding. Like those modems (ublox). This is pretty much straight forward.
Later, I want at least to have the components potted and sealed, like a typical SIP design. Maybe use dies instead of components for further miniaturisation. I have a bonding machine at hand for prototyping, we bought it for another project and used it maybe for 100 bonds, so I may be able to prototype a lot in-house.