That's a good question. Also, really hard to evaluate strictly quantitatively
Qualitatively, yes, I think the profile can be consistently hit. Some factors that make a difference are: ambient temp, amount the fluxlamp is cracked open, 40mm fan or no fan (optional, board has a mosfet installed and I've tested with both), PID controller tuning (defaults are pretty good), soldermask color (I noticed matte black is actually the most difficult since it absorbs so much heat, sometimes unevenly), location of the thermocouple (more important if no fan is used), thermocouple calibration (I've never done this, seems to work fine w/o).
There is a short shot of the profile in this video:
Of course realtime temp is being measured with the thermocouple, so this would need to be calibration & measured vs. board temp or/or avg oven temp to make sure it's correct, but that would be an offset from the profile temp, not variation along the profile over time. I also have a bolometric infrared sensor that can be wired to the Arduino (via headers on the PowerCore) that I was actually hoping to use to measure board temp. Still on my TODO list, and since these sensors are unfortunately quite expensive, I'm not sure if it's worth the cost.
Your comments have actually given me an idea though! I don't do this now, but since we have it, the actual temp profile (over time) could be logged and saved to a mobile app or web app, at the board level. This could both help refine the processes (detect problems when PIDs are out of tune, etc.) and catch/debug specific boards if there is a problem later, since we know exactly what happened during the reflow