What is kind of clear here is that there really isn't what I'd describe as an 'elegant' solution for this, that the more complex 'packaged IC' components get, the higher the frequencies get that the prototyping methods become really challenging.
I'm not dead against chemicals but I can be a real clumsy doofus with such stuff, I know the IPA story well having had the bottom drop out of a container whilst washing something - on the dining room table.
I like the idea of breakout boards for the SMD packages, I think I'll make sure to add an extra package for the making of these as I go.
I think some of the techniques used by you guys are a little tricky for one like me who lacks all the experience in build and layout strategies that you probably take for granted, I really need to force myself to learn some PCB layout stuff but I'm just not the artistic type so I struggle a lot with it.
Please keep the ideas coming, perhaps a eureka moment will occur ...