The thing is that return path at high frequencies go only right under the traces if there is a solid ground plane, so they will not travel to somewhere far away into the analog part.
... but the return currents of low-frequency signals (down to DC; including power!) do not follow the track on the top, but distribute over larger area, in the ratio of path resistances.
While solid, uncut, single ground plane is known to be optimal for
EMC and
EMI in almost all cases, the exception where cuts can increase performance is high-resolution, high-accuracy low-frequency single-ended analog signals. It does not help with EMI; but it helps with accuracy, simply by removing or reducing the DC supply return current from the measurement path.
Careful placement of parts is of course super important. When one reaches a solution which minimizes the DC level problem even without cutouts, that placement also carries least EMC risk if/when the cuts are added. In other words, the separate area where the "ground" acts like a pseudo-differential signal, should be at some corner of the PCB, far away from any fast signals. Crossing a plane gap with a fast signal is a disaster.