Footprint/Package Compatibility

[Teun]

Hi guys,

Is there some way of knowing which footprints are interchangable? I always just look for landpatterns in the datasheets to make sure components fit, if I don't immediately find it in my footprint library(s). Then I draw them myself. But often afterwards you realize many of them are interchangable, like for example "PQFN8 5X6", "DFN 5x6" and "PowerPAK SO".

Now JEDEC is supposed to be the "standard" for these things right?
I looked around a bit but I didn't find a general thing to make clear how component packages switch out. Is there a way to make sense of all this madness?!

Are there documents to show you which footprints fit which packages? How packages are named? Why some packages are barely different from others? Why some of them have double names?(SMA, DO214AC) etc.
 

[Alti]

I think JEDEC defines package only.
The footprint might be different because of the height and weight of the component, tolerances, reflow or wave, assembly procedure, etc.
Interesting question.
Or rather: how to organize footprint management and minimize the mistakes.

[Siwastaja]

Case-by-case appnote research or worse, just trial&error, and experience gained doing that.

[Teun]

Or rather: how to organize footprint management and minimize the mistakes.

That would be the main point, yes 

I didn't think of package height yet. That is indeed a valid reason to have different names.
So the remaining question is: Is there some sort of database for similair footprints to packages? It would also be handy for selecting replacement components sometimes.