MIL-HDBK-217F part count method reliability prediction question - solder joints

[LeeCross]

I have an electronics reliability engineering question -

I am doing a MIL-HBDK-217F(N2) reliability prediction using the parts count method (Appendix A). How is the reliability of surface mount and through hole solder joints accounted for? Solder joints have an extensive analysis in the part stress method, but it is not clear to me how to handle them in the greatly simplified parts count method.