The best stuff that I could try was:
PAD: Fujipoly SARCON XR-m 17W/mK 0.49ºCcm^2/W @ 100kPa (50X-m Series)
PUTTY: Laird Technologies Tpcm 780 5.4W/mK 0.025ºCcm^2/W @ 350kPa (~ 0.2mm Thickness)
Laird Technologies Tpcm 580 3.8W/mK 0.1ºCcm^2/W @ 300kPa (~ 0.2mm Thickness)
GREASE: Dow Corning TC-5026 2.89W/mK 0.032 ºCcm^2/W (Hard to find)
Shin-Etsu X23-7783D 6W/mK 0.1ºCcm^2/W (Hard to apply)
The best by far, to use with CPUs GPUs or similar.
The BeO thermal conductivity is prety high ~200 W/mK, however, it supports high temperatures.
My question is, will it still be suitable as a thermal compound after 20+ years?
No idea!