Just pulled mine apart again, fully this time, after mentions of the PCB mechanical design in this area due to the large holes, and I can see the PCB flex noticeably around L2 & L3 when inserting/removing F2 (the 11A HRC fuse). The flex seems more pronounced around the nearby capacitors like C25, but the slots under L2 & L3 definitely create a weak area.
I think an extra moulded support and mounting screw for the PCB near the currrent shunt is required. Currently there is only one support in this area, and it is closer to the other end of F2. Another option, which wouldn't change the PCB, only the mould, would be to partly enlarge the mounting post near the COM terminal, so as to provide a support lip for the PCB. That would only help with downwards pressure on fuse insertion, but on fuse removal the matching half of the moulded case should hold the PCB against the upwards pressure. This assumes the fuses are installed after the PCB is in the case, which is probably not the case at the factory, so extra care may be required there.
In the meantime, I recommend being very careful when removing or inserting the HRC fuse. As this is likely to be a common fault, it would be nice to know the factory values of L2 & L3 for replacement purposes, so as to keep up with specs/compliance. I might remove them from mine for characterisation, or maybe that would be a great topic for an EEVblog video.
Because L2 has been substituted with an 0805 ferrite, I reckon it is more likely to survive fracture from PCB flexing than the 1206 L3. It does seem that the substitution to 0805 for L2 was an afterthought, and it only just makes it onto one pad of the footprint (see attached photo). So, on this meter at least, a hairline crack in the soldering of L2 seems much more likely than a broken component.