No idea ( don't watch TV), so not a clue.
As to the rings on the BGA package, they are there as part of the package design, to provide a fixed edge when routing out the layers so they do not peel or delaminate, and then a nice alignment aid for the bonder vision to recognise the ends of the multiple layers when bonding.. The copper planes will be power and ground planes, there as the chip needs high current and having this power and ground plane next to each other with only a thin laminate means the low capacitance is very effective and is very low inductance. Might be only 100pF for the whole set of planes, but the inductance is essentially mostly there from the multiple bond wires feeding the chip. For security there would be another laminate over the whole lot, with a similar one as the lowest laminate layer ( or just one in from a routing layer), with a few traces meandering across and connected to ground and the power rail, and also feeding the standby voltage that keeps the on chip RAM used for program storage alive. One or two microvias will link them at random across the BGA ball area to internal layers, and then to the chip. The power wires will be designed so they will short out to each other when you try to probe, and the traces connect to the die to enable it. Some self destruct ( a lot of high power IO cells connected together in the chip periphery that are normally tristated, and if tampering is detected they are turned on with the high and low side drives turned on so shorting the chip to cook it quickly). Same with the lid, though there you will need to have a connection made with silver loaded epoxy to the top mesh.
This chip does not have that, it is a regular ARM processor in a BGA package. No security, as the program resides in the external EEPROM, where it is trivial to read. It just is hot running, so they put the big passive cooler onto the package with a really good adhesive. Then there is 64M of DRAM right next to that for the Linux OS to run in.