We make many threads for Rigol DP832 and I didn't know where to post it...
I had a contact with Rigol via local dealer where I am living, about Top Board Revision vs Thermal Behavior of LM317.
I sent them three photos, one with the first topology of LM317 with the two capacitors and LM to be very closed together (I call this "First Board Revision"), the second with the movement of capacitors and LM317 (I call this "Second Board Revision") and the last that we call Revision 2.1 with the big heatsink (I call this "Third Board Revision").
The answer of Rigol about this was : the first picture you send ("First Board Revision")are from the board Rev. V2.0, the others two are from the board Rev. 2.1, so no need to change ! On the old Rev ("First Board Revision") the heatsink is directly located next to 2 brown C’s.
Not the Size of the heatsink is important – the location is important – Also on the port is written which version it is.
From what I understand from this answer is that the last two versions that we have captured ("Second Board Revision", "Third Board Revision"), are from the same Top Board Revision (2.1) and the only Top Board that they change - under the warranty - is only the Revision 2.0 ("First Board Revision").
Have you any other information about this?
(Last Edit = with some syntax corrections)