The reason for the epoxy on the corners of the NVidia Tegra is that this is a mobile device and the Tegra is a BGA device. If the Nexus is shocked by dropping it, then the circuit board will flex and this plays havoc with BGAs by cracking its balls. I know I have had to change 1000s of em (very expensive parts). The physically weakest points of any BGA are the corners. This is because the corner balls there have the least support from the balls around it and so get the most stress. When I troubleshoot boards with BGAs the problems are most often with signals near the corners of the BGA parts. Second most likely are along the sides. I used to keep a notebook and track failures with drawings of the bad ball locations and it showed the significance of this problem. If the board is never shocked (in shipping or customers dropping it or whatever) the BGAs are very reliable. Anyway, the epoxy is to add support for those weak areas. I really hate BGAs in portable products though it depends on the mechanical design of the chassis and board mount positions. I wonder how well the epoxy method works.