To bad that the amplifier board didn't have discrete transistor driver and output power stages for each channel , instead of one of those Class A/B modules which have a lot more T.H.D. when driven hard
Agree. Chip power amps have two problems; crossover distortion at low levels because they have no standing current adjustment, and running out of power transistor drive at high levels because they typically use multi-NPN darlington arrangements with high burden volts.
Class D ICs using FET output stages tend to give better sound quality, only IME they are very blow-up prone. Even driving into distortion can cause some of them to pop.
For any critical application I'd go for a discrete complementary arrangement though.
Other point, that heatsink is the wrong way round and won't dissipate much. Plus, stainless may look nice but it's not a very good conductor of heat. (Ever watched a blacksmith hammering the red-hot end of a piece of steel whilst holding the other cold end in his hand? Try that with ally or copper and it will be ouch time.)