Thanks everyone for the advice and the support
I've been using a chisel tip, I tried a conical but it was definitely more difficult. I should also mention I'm using a $20 soldering iron I bought around 7 years ago, so I definitely don't trust the accuracy of its temperature and I don't have a thermocouple to check it. It also doesn't have the feature where when you set it down it automatically cools down, so I can also see that leading to some problems with oxidation if I didn't thoroughly clean the tip between placing a component and soldering it (don't worry, a "proper" soldering station will be my next purchase
).
Regarding using hot air, I had purchased an Atten ST-862D but I'm still waiting to receive it. I'm hoping I get it next week to test it out.
Yes, the right pad of C1 is pretty much spot-on.
The reason why blobbiness is bad is it hides whether the solder flowed into the PCB pad or not. It could be just a blob hanging on the component lead; or it could be actually connected to the PCB, you can't say by looking at it. Otherwise than that, excess solder does not matter.
Finally, hand-soldering is not a beauty contest. It's hobby/prototyping and most important is to recognize which problems truly reduce reliability. For example, R1 looks a bit ugly but it's 100% fine really. But C2 and C3 left pad leave a hanging question, are they connected to the PCB? Probably yes but can't be sure.
Thanks, I wasn't sure about the blobby joints, but this helps me understand what the problem with them might be. And this definitely makes me feel less self-conscious about how it looks
IMO all but the LH side of C11 have an unnecessary amount of solder on them.
You need set up a tip cleaner of brass or steel wool and use it to remove excess tip solder and by retouching joints remove excess to get a better shaped solder fillet that should never be higher than the component.
And BTW, welcome to the forum.
I've been using brass wool for cleaning, but will be more mindful of this going forward. Also I wasn't sure if the solder should just cover the top edge of the component or be below it, will try to keep it below the top edge in the future and to keep it concave. And thanks for the welcome
One question about this comment:
Two things cause the spikes: oxidation and solder “contamination” from copper, gold, etc from pads and component leads dissolving into the solder, which happens more if you take too long (which is normal when starting out!). The oxidation and/or unwanted dissolved metals change the properties for the worse. When you observe this, “rinse” your tip with fresh solder so that it drips off, wipe clean, rinse again, wipe again, and then re-tin with a small amount of solder to protect the tip and to act as a thermal bridge.
The solder contamination could definitely be a factor, I'm still getting a feel for how long to hold the iron to the pad. Other than cleaning and re-tinning the tip, if I suspect this contamination should I attempt to remove the solder with some solder wick first or should I not worry about that?
Overall, I think the main things for me to focus on are keeping the tip clean and free of oxidation and adding enough flux. I've tried a flux pen in the past (SRA #99-20 RMA Rosin Flux Pen), and while I found it much more convenient than tacky flux, I found that the tacky flux produced better results for me (MG Chemicals 8341 No Clean Flux Paste). But I'll try both again with some different brands.
Thanks again everyone!