So, I'm working with BGA components which have a relatively fine pitch. Given the part, I ordered a stencil from Osh Stencils for the occasion. What I usually do with stencils, I use a solder-paste spreader (AKA, a plastic card) and run the paste over the stencil, fill in the holes, lay out the parts, and bake it in my oven. Pretty straightforward. I was wondering if you guys might have any techniques and whatnot that would make the process easier. Is it best to have the solder-paste be a bit runny, or should it be clay-like/solid? When I use my solder-paste, it's kept in a chemical fridge, and it's essentially solid when being used making it hard to actually get paste and smear it over the stencil.