Stay away from tools like that heated desoldering pump (third post), they usually have very little suction and it takes time to bring the tip back to temperature between pins. Basically, it's very annoying.
Desoldering guns like the one in the post above work great, if you get the technique right. Basically, you may even have to add a bit of solder, then put the nozzle over the pin when it's hot enough, make some small circles with the tip around the pin to detach it from the walls of the hole and then suck the solder. Once you get the move, you desolder one pin in 2-3 seconds.
Just remember to not desolder pins sequencially, as you may overheat the chips or the board if you put heat in the same region, jump from side to side of the IC.
Unless you have high quality wick (with built in quality flux), stay away from it, it's more hassle than it's worth otherwise. I've bought cheap solder wick and hated it so much I almost gave up on using wick until I borrowed a quality (expensive) one with good flux in it. Makes huge difference.
What I would do is apply a bit of liquid flux over the pins, then optionally (if I feel it's needed, if there's very little solder in the first place) add a bit of solder to each pin (doesn't matter if it's lead free or not), then go with the iron and heat the pins and use a regular quality solder sucker to suck the solder. I have an aluminum one with a long spring, which makes a lot of suction.... and if you want you can improve it by adding a tiny bit of silicone tube over the existing tip, the silicon will tolerate the heat well and last a long time.