What pin gets hot? MIC5219 SOT-23-5

[Bootalito]

I'm designing a PCB for a reflow oven (https://easyeda.com/terryjmyers/ESPReflow).  I'm using a MAX31856 thermocouple amplifier and powering the analog power pin from a low noise LDO (MIC-5219 sot-23-5 package http://www.mouser.com/ds/2/268/mic5219-779135.pdf).  I want to do a small top layer pour underneath the LDO to dissipate heat (mainly away from the MAX31856).  What pin should I connect it to?  I also realize that the MAX31856 will not draw very much power, therefore the LDO will not get that hot, but I still want to do a thorough design.
The sot-23-5 package doesn't have a thermal pad.  On the packages that do, its connected to GND. Also, there are packages with multiple GND pins, presumably for heat dissipation.  Is it save to assume the GND pin on the SOT-23-5 will be the pin that gets hot?

TLDR: Is it safe to assume that the GND pin of the sot-23-5 package of a mic2519 LDO is the one I should connect to a PCB heatsink, based on the other packages having more GND pins or exposed thermal pads connected to GND?

[Howardlong]

Ground pin is a good start, and sneaking in a few closely packed vias to the other side of the board and any multilayer ground plane is a good plan. There’s also no harm in using wider tracks elsewhere, but ground is a good start, and it’s often flood filled anyway on the board and is typically the die’s substrate.

[Zero999]

I'd say the ground pin, given that the packages with a thermal pad connect it to ground.