Unless you have a huge BGA, or a PCB with a huge amount of copper, all you should need to solder a BGA is a hot air rework tool. It requires some skills, but its no harder than anything else.
The downside is, if you make a mistake, you then need to reball the BGA chip before you try again, which also requires some skill and a stencil + solder paste or solar balls.
BGA isnt hard, just higher consequences of screwing it up and needing to spend time reballing it.
Or you can just accept the cost of a wasted IC and get a new one.
Screwing up a QFP/QFN usually just means you bridged some pads and need to grab the solder wick, which only takes a few seconds to fix. Perhaps worst case with QFN/DFN you just have to lift the part up re-tin the pads and put it back down.